PCOM-B657VGL

Intel 11th Gen(Tigerlake-H)

11th Generation Intel® Core™/Xeon® W-11000E Series Processors (TigerLake-H) based COM Express Type VI Basic module with DDR4, PCIe Gen 4, USB 3.2 Gen 2 and 2.5GbE

Image-empty-state.png

Features

  • 11th Gen Intel® Core™, Xeon® W-11000E Series, and Celeron® processors in10nm Super Fin Process technology (Formerly TigerLake-H)

  • AI/DL Instruction Sets (Intel® VNNI, AVX-512, INT8, FP16), up to 8C/16T@45Wand 25W with wide temperature SKUs support

  • 2x DDR4-3200 ECC/Non-ECC SO-DIMMs, up to 2x 32GB

  • 1x PCIe Gen 4 x16, 8x PCIe Gen 3 x1, 4x USB 3.2 Gen 2, 4x USB 2.0, 2.5GbEwith TSN, 4x SATAIII

  • Four Independent Displays: 3x DDI, eDP/LVDS, VGA

Specification

  • Form Factor : COM Express® Type 6 Basic Module (125 X 95mm)

  • Graphics :  Base Freq.350 MHz

  • HW Encoding: One VEBox:H.264/AVC, H.265/HEVC, JPEG, VP9

  • HW Decoding: Two VDBoxes:H.264/AVC, VP9, H.265/HEVC, AV1, VC1, MPEG2, JPEG/MPEG, MPEG2

  • HW Acceleration: DirectX 11/12, Open GL 4.5, OpenCL 2.1

  • BIOS: AMI BIOS

  • Memory Type/Speed: DDR4 SO-DIMM 3200MT/s up to 64GB

  • SATA: 4x SATA III (Port 0~3)

  • USB: 4x USB 3.2 Gen 2 (Port 0~3) 8x USB 2.0 (Port 0~7)

  • PEG : 1x PCIe Gen 4 x16 (can be configured to 1 x16, 2 x8 or 1 x8 + 2 x4)

  • PCI Express: 8x PCIe Gen 3 x1 (can be configured to 8 x1, 4 x1 + 1 x4, or 2 x4) Support Intel® RST for PCIe Storage for both x4 Link

  • Security: TPM 2.0 (Infineon SLB9670), Intel® AES-NI, Intel® SHA Extensions, Intel® DAL

  • Dimension: 125 x 95mm

  • Power DC IN:Normal: +12V DC
    AT/ATX mode

  • Storage Temperature: -20°C to 85°COperation 

  • Temperature: 0°C to 60°C (General Embedded SKU)
    0°C to 60°C (Industrial 25W SKU)
    -40°C to +85°C (Industrial 45W/35W SKU)

  • Certification: Contact us

  • OS: Windows 10, Ubuntu, CentOS, Yocto

온라인 주문 양식

주문해 주셔서 감사합니다!