PBPE-03V-A

The EXMP-Q911 COM-HPC Mini Module leverages Qualcomm’s latest
innovation—the DragonwingTM IQ-9075 SoC—to deliver high AI computing
performance with low power consumption.

Fanless Compact System with NVIDIA® Jetson Orin Nano™ SOM for Edge AI Applications
-152x109x63 mm

SMARC® Module with MediaTek Genio 510 Application processor

X7213RE/X7433RE, 32GB LPDDR5, 256GB eMMC, 2.5GbE x2, USB-C, COM x2, -40~70°C, AI-ready, IP30.
-120x 74x 120mm

Fanless Compact System with NVIDIA® Jetson Orin™ NX SOM for Edge AI Applications
-152x112x90 mm

Fanless Compact System with NVIDIA® Jetson Orin Nano™ SOM for Edge AI Applications
-152x109x63 mm

SMARC Module with Intel®Atom™ x7000RE ® processors family (HDMI+LVDS)

Embedded Rugged Fan-less System with Intel Celeron® J6412 SoC, 2x PoE LAN and 16x DI + 16x DO support

Fanless Compact System with NVIDIA® Jetson Orin™ NX SOM for Edge AI Applications
-152x112x90 mm

Fanless Compact System with NVIDIA® Jetson AGX Orin™ SOM for Edge AI Applications
-180 x 60 x 135 mm

3.5” SMARC 2.1 Compliance Carrier with multiple displays and two 2.5GB Ethernet ports

Compact, fan-less embedded system powered by the Intel Atom Processors x7000RE Series
- 120 x 120 x 54 mm