Intel® Core Ultra 9/7/5, 65W; Dual SO-DIMM DDR5 up to 96GB; PCIe Gen5x16, M.2 Key E/CNVI, M.2 Key M NVMe; Dual Ethernet, 5x COM, 11x USB 3.2, 4x SATA III
LGA1700 R680E/Q670E Micro-ATX motherboard, LGA1700 Socket for 13th/12th Gen Intel CPU, 4*U-DIMM, 4*Lan, 1*PCIe x16 slots, 3xPCIe x4 slots, 2*DP, 1*HDMI, 1*LVDS/eDP,1*M.2 M key, 1*M.2 E key, 8*SATA, 6*USB 3.2 Gen 2, USB Type C
The EXMP-Q911 COM-HPC Mini Module leverages Qualcomm’s latest innovation—the DragonwingTM IQ-9075 SoC—to deliver high AI computing performance with low power consumption.