top of page
포트웰코리아_톡상담아이콘

PCOM-B659

산업용 보드/모듈 Intel 13세대( Raptor Lake-P)

COM Express Type VI Compact Size Module based on 13th Gen Intel® Core™ Processors (formerly Raptor Lake-P) with DDR5 SO-DIMM, DDI, PCIe Gen 4, USB4, USB 3.2 Gen 2, 2.5 GbE TSN Ethernet, discrete TPM 2.0, eDP, SATAIII

Image-empty-state

Features

  • 13th Gen Intel® Core™ processors series (formerly Raptor Lake-P)

  • Up to 14C/20T, and up to 96x graphic execution units

  • 2x DDR5-4800 non-ECC SO-DIMMs up to 64GB, 2x Gen 4 x4, and 8x PCIe Gen 3 x1

  • 4x USB 3.2 Gen 2, 8x USB 2.0, 2x SATAIII, 3x DDI, VGA, eDP/LVDS, 2x USB4 (option)

  • Industrial temperature range -40°C to +85°C (option)

  • Onboard PCIe NVMe SSD (option)

Image-empty-state
Image-empty-state
Image-empty-state
The Portwell PCOM-B659 is a COM Express Type VI Compact size module designed with the 13th Gen Intel® Core™ P/U-series processors, and based on the PICMG COM Express Module Base Specification Rev 3.1. Specifically, the 13th Gen Intel Core processor platform adopts Intel 7 lithography process and supports AI acceleration with Intel Deep Learning Boost (VNNI) to offer advanced computing performance with 15~45W thermal power for dynamic embedded use conditions. PCOM-B659 features PCIe Gen 4 and 2x non-ECC DDR5 SO-DIMM interfaces, and is suitable for mission critical use cases and AI edge computing. It also provides (up to) 8x PCIe Gen 3 x1 lanes, 2x USB4 (option), 4x USB 3.2 Gen 2, and 2x SATA III. Moreover, its extensive and flexible I/O capacity makes it ideal for diverse embedded/industrial applications.

2018_Portwell Logo

서울특별시 금천구 가산디지털1로 5(가산동 691)  대륭테크노타운 20차 1709호 (우: 08594)
#1709, Daeryung Techno Town 20th, 5, Gasan-digital 1-ro, Geumcheon-gu, Seoul, 08594, Korea

T) +82-2-2225-0008
F) +82-2-2225-0009
E) sales@portwell.co.kr 

Copyright © 2025 by Portwell Korea, Inc. All Rights Reserved

bottom of page