BOXER-8231AI-KIT

Intel® Atom™ processor E3900 product family (formerly Apollo Lake) based Type VI Compact COM Express module with up to 8GB DDR3L SDRAM on two 204-pin SODIMM slots, DisplayPort, Gigabit Ethernet, 4x PCIe x1 or 1x PCIe x4, SATA, USB, and eMMC, and support for industrial temperature range -40°C~85°C

Intel Atom® x6000E Series SoC based NANO-ITX Board with Triple Display, GbE LAN, USB 3.2 Gen 2, M.2, SATA III, Mini-PCIe, and mSATA

Intel® 10th Gen Xeon/Core™ Processors based FlexATX with DDR4 Long-DIMM up to 128 GB, DP/HDMI, Dual Gigabit Ethernet and 20 USB Ports

SBC Backplane PCI-E x16

11th Generation Intel® Core™/Xeon® W-11000E Series Processors (TigerLake-H) based COM Express Type VI Basic module with DDR4, PCIe Gen 4, USB 3.2 Gen 2 and 2.5GbE

TPM 2.0, 8x intrusion inputs, I2C FRAM, H/W unique ID, Software defined LED, 8x DIDOs, 2xDP(V1000)/1xDP(R1000), 1x HDMI 2.0, 1x HDMI 1.4. - 180(W) x 180(D) x 70(H) mm

LGA1151 v2 Desktop Intel® 8th/9th Gen Core™ Processors thin Mini-ITX with DDR4 SO-DIMM up to 64GB, Display port, HDMI, DVI, LVDS, 4x GbE LAN, and TPM 2.0

7 slot PICMG 1.3 PCI Express backplane

Qualcom Snapdragon 450 1.8GHz, Corning Gorilla 3, IP65, 205g, Android 8

LGA1151 Intel® 7th and 6th Gen Core™ Processors with DDR4 SDRAM(up to 64G),
1x PCI Express x16 Slot or 2xPCI Express x8 slot, 2x PCI Express x4, 3x PCI,
Triple Display, 2x GbE, 6 x SATA 3.0, USB 3.0 & 4x COM

PCIe x1(4), PCIe x16(1)

LGA1200 Intel 10th Gen ® Core™ processors and Q470E chipset (Comet lake-S) based Mini-ITX board with DDR4 SO-DIMM up to 64GB, triple displays, dual GbE LAN, and TPM 2.0