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PCOM-B800GT 산업용 보드/모듈 Intel® Xeon® D-2700 Series Processor (Ice Lake-D HCC), COM-HPC Server Type E COM-HPC Server Type E module with Intel® Xeon® D-2700 series Processor Features 카탈로그 견적요청 Intel® Xeon® D-2700 Series Processor (Ice Lake-D HCC) AI/Deep Learning Accelerate Data Analytics with Intel® AVX-512 and VNNI 8x 10G KR, 4x USB 3.2 Gen 1/2.0, 2x SATAIII, 2x UART 2x PCIe 4.0 x16 from CPU (Bifurcation support: x16, x8, x4) and 2x PCIe 3.0 x8 (Bifurcation support: x8, x4, x2, x1) TDP 65W to 118 W Consumption General Specification Order info Related product(s) PCOM-B800GT, a COM-HPC Server Type Size E module (200mm x 160mm), is based on Intel® Xeon® D-2700 series processors. In this architecture, it can support up to 20 cores within the TDP from 65W to 118W. Selected SKUs support wide temperature range. PCOM-B800GT features eight 10GbE KR LAN interfaces, 32 PCIe 4.0 lanes and 16 PCIe 3.0 lanes, TPM 2.0 and eight DDR4 Long-DIMMs up to 1024GB in total. Portwell can provide both PCOM-B800GT module and carrier board design verification, as needed. [Application Note] PCOM-B800GT: A COM-HPC Server Type Size E Module with Intel® Xeon® D-2700 Processor that Adds a Dynamic Element to Empower “Smarter” Edge IoT PCOM-B800GT COM-HPC Server Type E module with Intel® Xeon® D-2700 series Processor 안내) 주문과 관련된 자세한 정보는 한국지사에 문의를 주시면, 단가, 재고 상황 및 납기 정보를 회신 드리겠습니다. email) sales@portwell.co.kr Tel ) 031-450-3043 PJAI-1100F-OX16G Fanless Compact System with NVIDIA® Jetson Orin™ NX SOM for Edge AI Applications -152x112x90 mm 제품확인 PJAI-1100-ON4G Fanless Compact System with NVIDIA® Jetson Orin Nano™ SOM for Edge AI Applications -152x109x63 mm 제품확인 WSC-M32 SMARC Module with Intel®Atom™ x7000RE ® processors family (HDMI+LVDS) 제품확인 WEBS-89I1 Embedded Rugged Fan-less System with Intel Celeron® J6412 SoC, 2x PoE LAN and 16x DI + 16x DO support 제품확인 PJAI-1100F-OX8G Fanless Compact System with NVIDIA® Jetson Orin™ NX SOM for Edge AI Applications -152x112x90 mm 제품확인 DEV2725 Fanless Compact System with NVIDIA® Jetson AGX Orin™ SOM for Edge AI Applications -180 x 60 x 135 mm 제품확인 WSC-C350 3.5” SMARC 2.1 Compliance Carrier with multiple displays and two 2.5GB Ethernet ports 제품확인 LYNX-8110 Compact, fan-less embedded system powered by the Intel Atom Processors x7000RE Series - 120 x 120 x 54 mm 제품확인 PJAI-1100-ON8G Fanless Compact System with NVIDIA® Jetson Orin Nano™ SOM for Edge AI Applications -152x109x63 mm 제품확인 WSC-M510 SMARC® Module with MediaTek Genio 510 Application processor 제품확인 LYNX-812E X7213RE/X7433RE, 32GB LPDDR5, 256GB eMMC, 2.5GbE x2, USB-C, COM x2, -40~70°C, AI-ready, IP30. -120x 74x 120mm 제품확인 Nano-6065 Intel® Core™ Processor N-series/Intel® Processor N-Series/Intel Atom® x7000RE Series Processors based NANO-ITX Board with Triple Display, 2.5GbE LAN, USB 3.2 Gen2, M.2, SATA III 제품확인 Load more 1 2 3 4 5 1 ... 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 ... 29

PCOM-B883VG2 산업용 보드/모듈 Intel 12th Gen(Alderlake-H/P/U), COM-HPC® Client module Size B COM-HPC® Client module Size B module with Intel® 12th Gen H/P/U Processor (Alder Lake-P) DDR5 SO-DIMM, DDI, PCIe Gen4, USB4, USB3.2 Gen2, 2.5 Gigabit TSN Ethernet, discrete TPM 2.0, eDP, SATA III Features 카탈로그 견적요청 COM-HPC® Client Type, Size B 12th Gen Intel® Core™ Processors (Alder Lake-H/P/U) and Intel® Celeron® Processor 7000 Series (Alder Lake-U) featuring Intel® 7 lithography Up to 64GB Dual-channel DDR5 Non-ECC 4800 MT/s on two SO-DIMM sockets 1x PCIe Gen 4 x8 (selected SKUs), 2x PCIe Gen 4 x4, 8x PCIe Gen 3 x1 2x 2.5GbE via Intel® Ethernet Controller I225LM 2x USB4, 2x USB3.2 Gen 2, 8x USB2.0 Support multimedia interface: - 3x DDI (DP), 1x eDP/DSI for display - I²S for audio - 1x CSI for camera General Specification Order info Related product(s) The Portwell PCOM-B883VG2 is a COM-HPC Client Type Size B module based on the 13th Gen Intel® Core™/12th Gen Intel® Core™ processor series (formerly Raptor Lake-P/Alder Lake-P). It is compatible with COM-HPC 1.0 standard. The platform, featuring Intel® 7 lithography and VNNI (Vector Neural Network Instructions), offers advance computing power with 15W~45W TDP, and complete and flexible I/O capabilities for a wide range of industrial use cases and applications. The PCOM-B883VG2 COM-HPC Client Type Size B module also provides support for 8x PCIe Gen3 x1 lanes, 2x USB4, 2x USB 3.2 Gen 2 and 2x SATA III interfaces. Moreover, it supports up to PCIe Gen5 x8 on selected SKUs, additional 2x PCIe Gen4 x4 lanes for high speed PCIe storage, 2x non-ECC DDR5 SO-DIMM, and dual 2.5GbE equipped with Intel Time Sensitive Networking (TSN) technologies, making it suitable for mission critical use conditions and AI edge computing. [Application Note] PCOM-B883VG2: A COM-HPC Client Type Size B Module with 13th Gen Intel® Core™ Processor for Medical Equipment and Industrial Control Solutions PCOM-B883VG2 COM-HPC® Client module Size B module with Intel® 12th Gen H/P/U Processor (Alder Lake-P) DDR5 SO-DIMM, DDI, PCIe Gen4, USB4, USB3.2 Gen2, 2.5 Gigabit TSN Ethernet, discrete TPM 2.0, eDP, SATA III 안내) 주문과 관련된 자세한 정보는 한국지사에 문의를 주시면, 단가, 재고 상황 및 납기 정보를 회신 드리겠습니다. email) sales@portwell.co.kr Tel ) 031-450-3043 PJAI-1100F-OX16G Fanless Compact System with NVIDIA® Jetson Orin™ NX SOM for Edge AI Applications -152x112x90 mm 제품확인 PJAI-1100-ON4G Fanless Compact System with NVIDIA® Jetson Orin Nano™ SOM for Edge AI Applications -152x109x63 mm 제품확인 WSC-M32 SMARC Module with Intel®Atom™ x7000RE ® processors family (HDMI+LVDS) 제품확인 WEBS-89I1 Embedded Rugged Fan-less System with Intel Celeron® J6412 SoC, 2x PoE LAN and 16x DI + 16x DO support 제품확인 PJAI-1100F-OX8G Fanless Compact System with NVIDIA® Jetson Orin™ NX SOM for Edge AI Applications -152x112x90 mm 제품확인 DEV2725 Fanless Compact System with NVIDIA® Jetson AGX Orin™ SOM for Edge AI Applications -180 x 60 x 135 mm 제품확인 WSC-C350 3.5” SMARC 2.1 Compliance Carrier with multiple displays and two 2.5GB Ethernet ports 제품확인 LYNX-8110 Compact, fan-less embedded system powered by the Intel Atom Processors x7000RE Series - 120 x 120 x 54 mm 제품확인 PJAI-1100-ON8G Fanless Compact System with NVIDIA® Jetson Orin Nano™ SOM for Edge AI Applications -152x109x63 mm 제품확인 WSC-M510 SMARC® Module with MediaTek Genio 510 Application processor 제품확인 LYNX-812E X7213RE/X7433RE, 32GB LPDDR5, 256GB eMMC, 2.5GbE x2, USB-C, COM x2, -40~70°C, AI-ready, IP30. -120x 74x 120mm 제품확인 Nano-6065 Intel® Core™ Processor N-series/Intel® Processor N-Series/Intel Atom® x7000RE Series Processors based NANO-ITX Board with Triple Display, 2.5GbE LAN, USB 3.2 Gen2, M.2, SATA III 제품확인 Load more 1 2 3 4 5 1 ... 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 ... 29

PCOM-B881VG2 산업용 보드/모듈 Intel 11th Gen(Tigerlake-H), COM-HPC Client Size A 11th Gen Intel® Core™ Processors (Tiger Lake-UP3) based COM-HPC Client Size A module Features 카탈로그 견적요청 COM-HPC® Client type, size A 11th Gen Intel® Core™ Processor, up to 4 cores/28W TDP (Tiger Lake-UP3) Up to 64GB Dual-channel DDR4 Non-ECC 3200 MT/s on two SO-DIMM sockets, support In-Band ECC for industrial SKUs 1x PCIe Gen 4 x4, 2x PCIe Gen 3 x1, 1x PCIe Gen 3 x2, 1x PCIe Gen 3 x4 Up to 10 PCIe Gen 3 lanes (x16/ x8/ x4/ x2/ x1) from PCH 2x 2.5GbE Base-T with vPro Optional 4x USB 3.2 Gen 2 Support multimedia interface: - 3x DDI (HDMI/DP), 1x eDP/MIPI-DSI for display - 2x Soundwire, 1x I²S for audio - 1x MIPI-CSI for camera Extended operating temperature: -40 ~ 85 °C (by CPU SKUs) General Specification Order info Related product(s) Portwell PCOM-B881 is COM-HPC® Client Type Size A module designed with 11th Gen Intel® Core™ Tiger Lake-UP3 processors. The platform supports DDR4 SO-DIMM 3200 MT/s memory up to 64GB, 4x PCIe Gen 4 and up to 10x PCIe Gen 3 lanes, 2x 2.5GbE Base-T Ethernet, and up to 4x USB 3.2 Gen 2 ports. PCOM-B881 also provides multimedia interfaces including 3x DDI and1x eDP for display, 2x Soundwire and 1x I2S for audio, and 2x MIPI-CSI for camera. PCOM-B881 featuring comprehensive media I/Os and data transmission interfaces with extended temperature support is ideal for a wide range of industrial applications. PCOM-B881VG2 11th Gen Intel® Core™ Processors (Tiger Lake-UP3) based COM-HPC Client Size A module 안내) 주문과 관련된 자세한 정보는 한국지사에 문의를 주시면, 단가, 재고 상황 및 납기 정보를 회신 드리겠습니다. email) sales@portwell.co.kr Tel ) 031-450-3043 PJAI-1100F-OX16G Fanless Compact System with NVIDIA® Jetson Orin™ NX SOM for Edge AI Applications -152x112x90 mm 제품확인 PJAI-1100-ON4G Fanless Compact System with NVIDIA® Jetson Orin Nano™ SOM for Edge AI Applications -152x109x63 mm 제품확인 WSC-M32 SMARC Module with Intel®Atom™ x7000RE ® processors family (HDMI+LVDS) 제품확인 WEBS-89I1 Embedded Rugged Fan-less System with Intel Celeron® J6412 SoC, 2x PoE LAN and 16x DI + 16x DO support 제품확인 PJAI-1100F-OX8G Fanless Compact System with NVIDIA® Jetson Orin™ NX SOM for Edge AI Applications -152x112x90 mm 제품확인 DEV2725 Fanless Compact System with NVIDIA® Jetson AGX Orin™ SOM for Edge AI Applications -180 x 60 x 135 mm 제품확인 WSC-C350 3.5” SMARC 2.1 Compliance Carrier with multiple displays and two 2.5GB Ethernet ports 제품확인 LYNX-8110 Compact, fan-less embedded system powered by the Intel Atom Processors x7000RE Series - 120 x 120 x 54 mm 제품확인 PJAI-1100-ON8G Fanless Compact System with NVIDIA® Jetson Orin Nano™ SOM for Edge AI Applications -152x109x63 mm 제품확인 WSC-M510 SMARC® Module with MediaTek Genio 510 Application processor 제품확인 LYNX-812E X7213RE/X7433RE, 32GB LPDDR5, 256GB eMMC, 2.5GbE x2, USB-C, COM x2, -40~70°C, AI-ready, IP30. -120x 74x 120mm 제품확인 Nano-6065 Intel® Core™ Processor N-series/Intel® Processor N-Series/Intel Atom® x7000RE Series Processors based NANO-ITX Board with Triple Display, 2.5GbE LAN, USB 3.2 Gen2, M.2, SATA III 제품확인 Load more 1 2 3 4 5 1 ... 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 ... 29

PCOM-B880VG2 산업용 보드/모듈 Intel 10th Gen(Comet lake-S), COM-HPC® Client Size C 10th Gen Intel® Core™/Xeon® W based COM-HPC® Client Size C Module Features 카탈로그 견적요청 COM-HPC® Client type, size C Intel® Xeon® W Processor, up to 10 cores/95W TDP (Comet Lake S) Up to 128GB Dual-channel DDR4 2933MT/s on four SO-DIMM sockets Multimedia interface: 1x eDP (Dual channel), 3x DDI (HDMI/DP) for display I²S for audio 2x 2.5GbE Base-T via Intel I225LM 1x PCIe Gen 3 x16, 3x PCIe Gen 3 x4, 8x PCIe Gen 3 x1 Optional 1x PCIe Gen 3 x1 for BMC 4x USB 3.2 Gen 2, 8x USB 2.0, 2x SATA III General Specification Order info Related product(s) Portwell's PCOM-B880VG2 is a COM-HPC® Client Type Size C module powered by 10th Gen Intel® Core™/Xeon® W platform (Formerly Comet Lake-S). The COM-HPC® Client form factor supports more I/O interfaces and power for desktop level CPU enabling wider computing demand applications. The desktop CPU on module offers customer higher computing power but lower cost comparing to mobile solutions. PCOM-B880VG2 supports both ECC and Non-ECC DDR4 by different PCH SKUs (Q470E/W480E), which can be adapted to different applications. This module provides one PCIe x16, four USB 3.2 Gen2, two SATA III, PCIe storage and up to twenty PCIe x1 lanes. PCOM-B880VG2 10th Gen Intel® Core™/Xeon® W based COM-HPC® Client Size C Module 안내) 주문과 관련된 자세한 정보는 한국지사에 문의를 주시면, 단가, 재고 상황 및 납기 정보를 회신 드리겠습니다. email) sales@portwell.co.kr Tel ) 031-450-3043 PJAI-1100F-OX16G Fanless Compact System with NVIDIA® Jetson Orin™ NX SOM for Edge AI Applications -152x112x90 mm 제품확인 PJAI-1100-ON4G Fanless Compact System with NVIDIA® Jetson Orin Nano™ SOM for Edge AI Applications -152x109x63 mm 제품확인 WSC-M32 SMARC Module with Intel®Atom™ x7000RE ® processors family (HDMI+LVDS) 제품확인 WEBS-89I1 Embedded Rugged Fan-less System with Intel Celeron® J6412 SoC, 2x PoE LAN and 16x DI + 16x DO support 제품확인 PJAI-1100F-OX8G Fanless Compact System with NVIDIA® Jetson Orin™ NX SOM for Edge AI Applications -152x112x90 mm 제품확인 DEV2725 Fanless Compact System with NVIDIA® Jetson AGX Orin™ SOM for Edge AI Applications -180 x 60 x 135 mm 제품확인 WSC-C350 3.5” SMARC 2.1 Compliance Carrier with multiple displays and two 2.5GB Ethernet ports 제품확인 LYNX-8110 Compact, fan-less embedded system powered by the Intel Atom Processors x7000RE Series - 120 x 120 x 54 mm 제품확인 PJAI-1100-ON8G Fanless Compact System with NVIDIA® Jetson Orin Nano™ SOM for Edge AI Applications -152x109x63 mm 제품확인 WSC-M510 SMARC® Module with MediaTek Genio 510 Application processor 제품확인 LYNX-812E X7213RE/X7433RE, 32GB LPDDR5, 256GB eMMC, 2.5GbE x2, USB-C, COM x2, -40~70°C, AI-ready, IP30. -120x 74x 120mm 제품확인 Nano-6065 Intel® Core™ Processor N-series/Intel® Processor N-Series/Intel Atom® x7000RE Series Processors based NANO-ITX Board with Triple Display, 2.5GbE LAN, USB 3.2 Gen2, M.2, SATA III 제품확인 Load more 1 2 3 4 5 1 ... 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 ... 29

PCOM-B885 산업용 보드/모듈 14th/13th Gen Intel® Core™ Processors (Raptor Lake-S Refresh/Raptor Lake-S) based COM-HPC Client Type Size C Module 14th/13th Gen Intel® Core™ Processors (Raptor Lake-S Refresh/Raptor Lake-S) based COM-HPC Client Type Size C Module Features 카탈로그 견적요청 COM-HPC® Client Type, Size C 14th/13th Gen Intel® Core™ Processors (Raptor Lake-S Refresh/Raptor Lake-S), Intel® Pentium® Gold Processor Series and Intel® Celeron® Processor G6900 Series featuring Intel® 7 lithography Up to 8x Performance-cores (P-cores) + 16x Efficient-cores (E-cores), and up to 32x graphics execution units 4x DDR5 ECC/non-ECC 3600 MT/s up to 192GB 1x PCIe Gen5 x16, 2x PCIe Gen4 x4, 3x PCIe Gen3 x4, 6x PCIe Gen3 x1 2x 2.5GbE via Intel® Ethernet Controller I226 series 4x USB3.2 Gen2x2, 8x USB 2.0 Support multimedia interface: - 3x DDI (DP), 1x eDP for display - I²S for audio General Specification Order info Related product(s) The Portwell PCOM-B885 is a COM-HPC Client Type Size C module based on the 14th/13th Gen Intel® Core™ Processors (formerly Raptor Lake-S Refresh/Raptor Lake-S) that features Intel® 7 lithography and VNNI (Vector Neural Network Instructions) offering advanced computing power with 35W~65W TDP. The PCOM-B885 COM-HPC module also supports the PCIe Gen5 x16 interface, and 4x ECC/non-ECC DDR5 SO-DIMM (memory capacity up to 192GB). In addition, it provides support for 2x PCIe Gen4, 18x PCIe Gen3, 4x USB 3.2 Gen 2x2, 2x SATA III, and dual 2.5GbE interfaces. Featuring high computing performance as well as a complete set of flexible I/O capabilities, the Portwell PCOM-B885 COM-HPC Client Type Size C module is suitable for diverse embedded applications across the industry, ranging from AI edge computing to mission critical use cases. PCOM-B885 14th/13th Gen Intel® Core™ Processors (Raptor Lake-S Refresh/Raptor Lake-S) based COM-HPC Client Type Size C Module 안내) 주문과 관련된 자세한 정보는 한국지사에 문의를 주시면, 단가, 재고 상황 및 납기 정보를 회신 드리겠습니다. email) sales@portwell.co.kr Tel ) 031-450-3043 PJAI-1100F-OX16G Fanless Compact System with NVIDIA® Jetson Orin™ NX SOM for Edge AI Applications -152x112x90 mm 제품확인 PJAI-1100-ON4G Fanless Compact System with NVIDIA® Jetson Orin Nano™ SOM for Edge AI Applications -152x109x63 mm 제품확인 WSC-M32 SMARC Module with Intel®Atom™ x7000RE ® processors family (HDMI+LVDS) 제품확인 WEBS-89I1 Embedded Rugged Fan-less System with Intel Celeron® J6412 SoC, 2x PoE LAN and 16x DI + 16x DO support 제품확인 PJAI-1100F-OX8G Fanless Compact System with NVIDIA® Jetson Orin™ NX SOM for Edge AI Applications -152x112x90 mm 제품확인 DEV2725 Fanless Compact System with NVIDIA® Jetson AGX Orin™ SOM for Edge AI Applications -180 x 60 x 135 mm 제품확인 WSC-C350 3.5” SMARC 2.1 Compliance Carrier with multiple displays and two 2.5GB Ethernet ports 제품확인 LYNX-8110 Compact, fan-less embedded system powered by the Intel Atom Processors x7000RE Series - 120 x 120 x 54 mm 제품확인 PJAI-1100-ON8G Fanless Compact System with NVIDIA® Jetson Orin Nano™ SOM for Edge AI Applications -152x109x63 mm 제품확인 WSC-M510 SMARC® Module with MediaTek Genio 510 Application processor 제품확인 LYNX-812E X7213RE/X7433RE, 32GB LPDDR5, 256GB eMMC, 2.5GbE x2, USB-C, COM x2, -40~70°C, AI-ready, IP30. -120x 74x 120mm 제품확인 Nano-6065 Intel® Core™ Processor N-series/Intel® Processor N-Series/Intel Atom® x7000RE Series Processors based NANO-ITX Board with Triple Display, 2.5GbE LAN, USB 3.2 Gen2, M.2, SATA III 제품확인 Load more 1 2 3 4 5 1 ... 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 ... 29

PCOM-B801GT 산업용 보드/모듈 Intel Atom® P5300 Series Processors COM-HPC Server Type Size D Module with Intel Atom® P5300 Series Processors Features 카탈로그 견적요청 Intel Atom® P5300 Series Processors up to 24 cores 16x PCIe 3.0, x8 10GbE KR (option 4x 25GbE KR) Support up to 4x DDR4 2667MT/s SO-DIMMs (select SKUs) All SKUs support Intel® QuickAssist Technology (Intel QAT) All SKUs support extended temperature from -40°C to 85°C) Optional dual NVMe SSD via PCIe 2.0 (one x4 or two x2), up to 1TB x2 General Specification Order info Related product(s) 최대 24코어 및 83W TDP의 인텔 아톰® P5300 프로세서로 구동되는 COM-HPC 서버 타입 사이즈 D 모듈인 PCOM-B801GT는 최대 4개의 SO-DIMM 슬롯을 지원하며 모든 SKU에 걸쳐 넓은 온도 범위를 제공합니다. 최대 100Gbps의 인텔® 퀵 어시스트 기술(QAT)을 통해 암호화 및 압축 작업을 가속화하며, PCOM-B801GT는 네트워크 스위치 컨트롤 플레인, 실외 5G 스몰셀, SD-WAN, 사설 5G 네트워크, 네트워크 보안 어플라이언스 등 까다로운 애플리케이션에 이상적입니다. 다양한 네트워킹 옵션을 위해 최대 8개의 10GbE KR 포트 또는 옵션으로 4개의 25GbE KR을 제공합니다. 또한 PCIe Gen2 인터페이스를 통해 온보드 NVMe 스토리지를 x4 1개 또는 x2 2개 구성으로 지원하여 고속 데이터 액세스와 유연성을 보장합니다. *Status: Preliminary PCOM-B801GT COM-HPC Server Type Size D Module with Intel Atom® P5300 Series Processors 안내) 주문과 관련된 자세한 정보는 한국지사에 문의를 주시면, 단가, 재고 상황 및 납기 정보를 회신 드리겠습니다. email) sales@portwell.co.kr Tel ) 031-450-3043 PJAI-1100F-OX16G Fanless Compact System with NVIDIA® Jetson Orin™ NX SOM for Edge AI Applications -152x112x90 mm 제품확인 PJAI-1100-ON4G Fanless Compact System with NVIDIA® Jetson Orin Nano™ SOM for Edge AI Applications -152x109x63 mm 제품확인 WSC-M32 SMARC Module with Intel®Atom™ x7000RE ® processors family (HDMI+LVDS) 제품확인 WEBS-89I1 Embedded Rugged Fan-less System with Intel Celeron® J6412 SoC, 2x PoE LAN and 16x DI + 16x DO support 제품확인 PJAI-1100F-OX8G Fanless Compact System with NVIDIA® Jetson Orin™ NX SOM for Edge AI Applications -152x112x90 mm 제품확인 DEV2725 Fanless Compact System with NVIDIA® Jetson AGX Orin™ SOM for Edge AI Applications -180 x 60 x 135 mm 제품확인 WSC-C350 3.5” SMARC 2.1 Compliance Carrier with multiple displays and two 2.5GB Ethernet ports 제품확인 LYNX-8110 Compact, fan-less embedded system powered by the Intel Atom Processors x7000RE Series - 120 x 120 x 54 mm 제품확인 PJAI-1100-ON8G Fanless Compact System with NVIDIA® Jetson Orin Nano™ SOM for Edge AI Applications -152x109x63 mm 제품확인 WSC-M510 SMARC® Module with MediaTek Genio 510 Application processor 제품확인 LYNX-812E X7213RE/X7433RE, 32GB LPDDR5, 256GB eMMC, 2.5GbE x2, USB-C, COM x2, -40~70°C, AI-ready, IP30. -120x 74x 120mm 제품확인 Nano-6065 Intel® Core™ Processor N-series/Intel® Processor N-Series/Intel Atom® x7000RE Series Processors based NANO-ITX Board with Triple Display, 2.5GbE LAN, USB 3.2 Gen2, M.2, SATA III 제품확인 Load more 1 2 3 4 5 1 ... 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 ... 29

PCOM-B658VGL 산업용 보드/모듈 Intel 12/13th Gen(Alderlake, Raptorlake) COM Express Type6 Basic size module with Intel® 12th / 13th Gen H/P/U Processor DDR5 SO-DIMM, DDI, PCIe Gen 4, USB4, USB3.2 Gen2, 2.5 Gigabit TSN Ethernet, discrete TPM 2.0, eDP, SATA III Features 카탈로그 견적요청 12th / 13th Gen Intel® Core™ ,Celeron® Series processors in Intel® 7 lithography Up to 6x performance core + 8x efficient core, and up to 96x graphic execution units 2x DDR5-4800 non-ECC SO-DIMMs up to 2x 32GB, 1x PCIe Gen4 x8(H series), 2x Gen4 x4, and 7x PCIe Gen3 x1 4x USB3.2 Gen2, 8x USB2.0, 2x SATAIII, 3x DDI, VGA, eDP/LVDS, and optional 2x USB4 I225/I226 Series ethernet General Specification Order info Related product(s) The Portwell PCOM-B658VGL is a COM Express Type VI Basic size module designed with the 13th Gen Intel® Core™/12th Gen Intel® Core™ processor series (formerly Raptor Lake-P/Alder Lake-P), and based on the PICMG COM Express Module Base Specification Rev 3.1. The core computing platform adopts Intel 7 lithography process and supports AI acceleration with Intel Deep Learning Boost (VNNI), offering advanced computing performance with 15W~45W thermal power for embedded use condition in a wide range of applications. The PCOM-B658VGL also supports PCIe Gen 4 and 2x non-ECC DDR5 SO-DIMM interfaces, and is suitable for mission critical use cases and AI edge computing. This module also provides (up to) 7x PCIe Gen 3 x1 lanes, 2x USB4 (option), 4x USB 3.2 Gen 2, and 2x SATA III. In addition, the extensive and flexible I/O capacity makes it ideal for diverse embedded/industrial applications. [Application Note] PCOM-B658VGL: A COM Express Type 6 Module Featuring 13th Gen Intel® Core™ Processors for Medical Devices, Industrial Control and Edge Computing Solutions PCOM-B658VGL COM Express Type6 Basic size module with Intel® 12th / 13th Gen H/P/U Processor DDR5 SO-DIMM, DDI, PCIe Gen 4, USB4, USB3.2 Gen2, 2.5 Gigabit TSN Ethernet, discrete TPM 2.0, eDP, SATA III 안내) 주문과 관련된 자세한 정보는 한국지사에 문의를 주시면, 단가, 재고 상황 및 납기 정보를 회신 드리겠습니다. email) sales@portwell.co.kr Tel ) 031-450-3043 PJAI-1100F-OX16G Fanless Compact System with NVIDIA® Jetson Orin™ NX SOM for Edge AI Applications -152x112x90 mm 제품확인 PJAI-1100-ON4G Fanless Compact System with NVIDIA® Jetson Orin Nano™ SOM for Edge AI Applications -152x109x63 mm 제품확인 WSC-M32 SMARC Module with Intel®Atom™ x7000RE ® processors family (HDMI+LVDS) 제품확인 WEBS-89I1 Embedded Rugged Fan-less System with Intel Celeron® J6412 SoC, 2x PoE LAN and 16x DI + 16x DO support 제품확인 PJAI-1100F-OX8G Fanless Compact System with NVIDIA® Jetson Orin™ NX SOM for Edge AI Applications -152x112x90 mm 제품확인 DEV2725 Fanless Compact System with NVIDIA® Jetson AGX Orin™ SOM for Edge AI Applications -180 x 60 x 135 mm 제품확인 WSC-C350 3.5” SMARC 2.1 Compliance Carrier with multiple displays and two 2.5GB Ethernet ports 제품확인 LYNX-8110 Compact, fan-less embedded system powered by the Intel Atom Processors x7000RE Series - 120 x 120 x 54 mm 제품확인 PJAI-1100-ON8G Fanless Compact System with NVIDIA® Jetson Orin Nano™ SOM for Edge AI Applications -152x109x63 mm 제품확인 WSC-M510 SMARC® Module with MediaTek Genio 510 Application processor 제품확인 LYNX-812E X7213RE/X7433RE, 32GB LPDDR5, 256GB eMMC, 2.5GbE x2, USB-C, COM x2, -40~70°C, AI-ready, IP30. -120x 74x 120mm 제품확인 Nano-6065 Intel® Core™ Processor N-series/Intel® Processor N-Series/Intel Atom® x7000RE Series Processors based NANO-ITX Board with Triple Display, 2.5GbE LAN, USB 3.2 Gen2, M.2, SATA III 제품확인 Load more 1 2 3 4 5 1 ... 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 ... 29

MXM-M23A-M5 산업용 보드/모듈 Intel® Arc™ A350M Embedded MXM GPU Module with Intel® Arc™ A350M Features 카탈로그 견적요청 Intel® Arc™ A350M discrete GPU with 6 Xe-Cores Standard MXM 3.1 Type A form factor (82mm x 70mm) 4GB GDDR6 memory, 64-bit PCIe Gen4 x8 interface Support up to 4 DisplayPort 4K@ 60Hz, 25-35W TGP Support OpenVINO, Intel® Deep Link DirectX12 Ultimate, OpenGL 4.6, OpenCL 3.0, AV1, H.264/H.265 (HEVC) General Specification Order info Related product(s) Please refer to the datasheet or catalog. Thanks. MXM-M23A-M5 Embedded MXM GPU Module with Intel® Arc™ A350M 안내) 주문과 관련된 자세한 정보는 한국지사에 문의를 주시면, 단가, 재고 상황 및 납기 정보를 회신 드리겠습니다. email) sales@portwell.co.kr Tel ) 031-450-3043 PJAI-1100F-OX16G Fanless Compact System with NVIDIA® Jetson Orin™ NX SOM for Edge AI Applications -152x112x90 mm 제품확인 PJAI-1100-ON4G Fanless Compact System with NVIDIA® Jetson Orin Nano™ SOM for Edge AI Applications -152x109x63 mm 제품확인 WSC-M32 SMARC Module with Intel®Atom™ x7000RE ® processors family (HDMI+LVDS) 제품확인 WEBS-89I1 Embedded Rugged Fan-less System with Intel Celeron® J6412 SoC, 2x PoE LAN and 16x DI + 16x DO support 제품확인 PJAI-1100F-OX8G Fanless Compact System with NVIDIA® Jetson Orin™ NX SOM for Edge AI Applications -152x112x90 mm 제품확인 DEV2725 Fanless Compact System with NVIDIA® Jetson AGX Orin™ SOM for Edge AI Applications -180 x 60 x 135 mm 제품확인 WSC-C350 3.5” SMARC 2.1 Compliance Carrier with multiple displays and two 2.5GB Ethernet ports 제품확인 LYNX-8110 Compact, fan-less embedded system powered by the Intel Atom Processors x7000RE Series - 120 x 120 x 54 mm 제품확인 PJAI-1100-ON8G Fanless Compact System with NVIDIA® Jetson Orin Nano™ SOM for Edge AI Applications -152x109x63 mm 제품확인 WSC-M510 SMARC® Module with MediaTek Genio 510 Application processor 제품확인 LYNX-812E X7213RE/X7433RE, 32GB LPDDR5, 256GB eMMC, 2.5GbE x2, USB-C, COM x2, -40~70°C, AI-ready, IP30. -120x 74x 120mm 제품확인 Nano-6065 Intel® Core™ Processor N-series/Intel® Processor N-Series/Intel Atom® x7000RE Series Processors based NANO-ITX Board with Triple Display, 2.5GbE LAN, USB 3.2 Gen2, M.2, SATA III 제품확인 Load more 1 2 3 4 5 1 ... 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 ... 29

PEB-9783G2AR *Status: Project-based model. pls contact with sales team of Portwell Korea. 산업용 보드 Intel 10세대 (Comet lake) Intel® 10th Gen Xeon/Core™ Processors based FlexATX with DDR4 Long-DIMM up to 128 GB, DP/HDMI, Dual Gigabit Ethernet and 20 USB Ports Features 카탈로그 견적요청 Intel® 10th Gen processors (Comet Lake-S) 4x 288-pin Long-DIMM sockets support Dual Channel DDR4 up to 128 GB 20x USB ports, Dual Ethernet, 4x Serial ports, 2x SATAIII ports and Audio 1x PCIe x16 or 2x PCIe x8 or 2x PCIe x4 and 1x PCIe x8 (Gen 3) 1x M.2 Type M 2280 Triple independent displays On board TPM 2.0 General Specification Order info Related product(s) PEB-9783G2AR is based on the latest Intel® 10th Gen Xeon®/Core™ processors with W480E/Q470E chipset. This proprietary board supports DDR4, PCIe Gen 3, twenty USB, four COM, dual Ethernet, two SATA ports and 4K displays. Those features help you build high performance and stable system. Please see white paper for more information. PEB-9783G2AR Intel® 10th Gen Xeon/Core™ Processors based FlexATX with DDR4 Long-DIMM up to 128 GB, DP/HDMI, Dual Gigabit Ethernet and 20 USB Ports 안내) 주문과 관련된 자세한 정보는 한국지사에 문의를 주시면, 단가, 재고 상황 및 납기 정보를 회신 드리겠습니다. email) sales@portwell.co.kr Tel ) 031-450-3043 PJAI-1100F-OX16G Fanless Compact System with NVIDIA® Jetson Orin™ NX SOM for Edge AI Applications -152x112x90 mm 제품확인 PJAI-1100-ON4G Fanless Compact System with NVIDIA® Jetson Orin Nano™ SOM for Edge AI Applications -152x109x63 mm 제품확인 WSC-M32 SMARC Module with Intel®Atom™ x7000RE ® processors family (HDMI+LVDS) 제품확인 WEBS-89I1 Embedded Rugged Fan-less System with Intel Celeron® J6412 SoC, 2x PoE LAN and 16x DI + 16x DO support 제품확인 PJAI-1100F-OX8G Fanless Compact System with NVIDIA® Jetson Orin™ NX SOM for Edge AI Applications -152x112x90 mm 제품확인 DEV2725 Fanless Compact System with NVIDIA® Jetson AGX Orin™ SOM for Edge AI Applications -180 x 60 x 135 mm 제품확인 WSC-C350 3.5” SMARC 2.1 Compliance Carrier with multiple displays and two 2.5GB Ethernet ports 제품확인 LYNX-8110 Compact, fan-less embedded system powered by the Intel Atom Processors x7000RE Series - 120 x 120 x 54 mm 제품확인 PJAI-1100-ON8G Fanless Compact System with NVIDIA® Jetson Orin Nano™ SOM for Edge AI Applications -152x109x63 mm 제품확인 WSC-M510 SMARC® Module with MediaTek Genio 510 Application processor 제품확인 LYNX-812E X7213RE/X7433RE, 32GB LPDDR5, 256GB eMMC, 2.5GbE x2, USB-C, COM x2, -40~70°C, AI-ready, IP30. -120x 74x 120mm 제품확인 Nano-6065 Intel® Core™ Processor N-series/Intel® Processor N-Series/Intel Atom® x7000RE Series Processors based NANO-ITX Board with Triple Display, 2.5GbE LAN, USB 3.2 Gen2, M.2, SATA III 제품확인 Load more 1 2 3 4 5 1 ... 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 ... 29

WNU-ASL00 산업용 보드 Intel Atom® processors x7000RE Series(Amston Lake) NUC SBC with Intel Atom® processors x7000RE Series and DDR5-4800 SO-DIMM NUC SBC, Intel® Atom® processors x7000RE Series, 1 DDR5 SO-DIMM, 2x USB3.2, 2×2.5Giga Lan, 2x HDMI, 1 M.2 E Key 2230(USB2.0/PCIex1), 1 M.2 2280 Key M(PCIex4/SATA), 9 ~ 36V DC IN. Features 카탈로그 견적요청 Intel Atom® processors x7000RE Series DDR5-4800 SO-DIMM 8GB/16GB (option) Support 2x USB3.0, 2×2.5Giga Lan, HDMI Support multi I/O: 8 Digital I/O,1x I2C,1xRS232/422/485bus Support expansion like M.2 M key 2242/2280(PCIex4), M.2 E Key 2230(USB2.0/PCIex1) General Specification Order info Related product(s) 인텔 아톰® 프로세서 x7000RE 시리즈 DDR5-4800 SO-DIMM 8GB/16GB(옵션) USB3.0 2개, 2×2.5Giga 랜, HDMI 지원 멀티 I/O 지원 8개의 디지털 I/O, 1개의 I2C, 1개의 RS232/422/485버스 M.2 M 키 2242/2280(PCIex4), M.2 E 키 2230(USB2.0/PCIex1)과 같은 확장 지원 WNU-ASL00 NUC SBC with Intel Atom® processors x7000RE Series and DDR5-4800 SO-DIMM NUC SBC, Intel® Atom® processors x7000RE Series, 1 DDR5 SO-DIMM, 2x USB3.2, 2×2.5Giga Lan, 2x HDMI, 1 M.2 E Key 2230(USB2.0/PCIex1), 1 M.2 2280 Key M(PCIex4/SATA), 9 ~ 36V DC IN. 안내) 주문과 관련된 자세한 정보는 한국지사에 문의를 주시면, 단가, 재고 상황 및 납기 정보를 회신 드리겠습니다. email) sales@portwell.co.kr Tel ) 031-450-3043 PJAI-1100F-OX16G Fanless Compact System with NVIDIA® Jetson Orin™ NX SOM for Edge AI Applications -152x112x90 mm 제품확인 PJAI-1100-ON4G Fanless Compact System with NVIDIA® Jetson Orin Nano™ SOM for Edge AI Applications -152x109x63 mm 제품확인 WSC-M32 SMARC Module with Intel®Atom™ x7000RE ® processors family (HDMI+LVDS) 제품확인 WEBS-89I1 Embedded Rugged Fan-less System with Intel Celeron® J6412 SoC, 2x PoE LAN and 16x DI + 16x DO support 제품확인 PJAI-1100F-OX8G Fanless Compact System with NVIDIA® Jetson Orin™ NX SOM for Edge AI Applications -152x112x90 mm 제품확인 DEV2725 Fanless Compact System with NVIDIA® Jetson AGX Orin™ SOM for Edge AI Applications -180 x 60 x 135 mm 제품확인 WSC-C350 3.5” SMARC 2.1 Compliance Carrier with multiple displays and two 2.5GB Ethernet ports 제품확인 LYNX-8110 Compact, fan-less embedded system powered by the Intel Atom Processors x7000RE Series - 120 x 120 x 54 mm 제품확인 PJAI-1100-ON8G Fanless Compact System with NVIDIA® Jetson Orin Nano™ SOM for Edge AI Applications -152x109x63 mm 제품확인 WSC-M510 SMARC® Module with MediaTek Genio 510 Application processor 제품확인 LYNX-812E X7213RE/X7433RE, 32GB LPDDR5, 256GB eMMC, 2.5GbE x2, USB-C, COM x2, -40~70°C, AI-ready, IP30. -120x 74x 120mm 제품확인 Nano-6065 Intel® Core™ Processor N-series/Intel® Processor N-Series/Intel Atom® x7000RE Series Processors based NANO-ITX Board with Triple Display, 2.5GbE LAN, USB 3.2 Gen2, M.2, SATA III 제품확인 Load more 1 2 3 4 5 1 ... 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 ... 29

산업용보드 및 시스템, nVidia AI solution, MXM/COMe/SMARC/Q7 모듈, 산업용 샤시, 산업용 파워, 메디칼 모니터, Panel PC, No.1 솔루션 프로바이더 포트웰코리아(Portwell Korea) 회사소개 회사소개

RSQ18 산업용 시스템 , 팬리스 시스템 Intel Atom Alderlake N Series Support Intel® Atom® Alder Lake-N processors -180mm (L) x 180mm (W) x 40 mm (H) Features 카탈로그 견적요청 Intel® Alder Lake N (Quad-Core/Octa-Core) processor Support Triple display, HDMI/ USB C (DP) up to 4K resolution Support 1 x 260-pin DDR4 3200 MHz SO-DIMM, up to 16GB Fanless design 9V ~ 24V wide range power input Support M.2 B-key (w/ SIM Card Slot) & M.2 M-key & M.2 E-key General Specification Order info Related product(s) 적합하면 충분하고, 적을수록 좋습니다 - Mini-ITX 팬리스 박스 PC의 인텔 알더 레이크-N 플랫폼 RSQ18은 Mini-ITX 마더보드와 통합된 컴팩트하고 견고한 임베디드 컴퓨터로 기계 자동화, 산업 플랜트, 키오스크 제어 및 IoT 시장에 편리하면서도 안정적으로 사용할 수 있습니다. RSQ18 Support Intel® Atom® Alder Lake-N processors -180mm (L) x 180mm (W) x 40 mm (H) 안내) 주문과 관련된 자세한 정보는 한국지사에 문의를 주시면, 단가, 재고 상황 및 납기 정보를 회신 드리겠습니다. email) sales@portwell.co.kr Tel ) 031-450-3043 PJAI-1100F-OX16G Fanless Compact System with NVIDIA® Jetson Orin™ NX SOM for Edge AI Applications -152x112x90 mm 제품확인 PJAI-1100-ON4G Fanless Compact System with NVIDIA® Jetson Orin Nano™ SOM for Edge AI Applications -152x109x63 mm 제품확인 WSC-M32 SMARC Module with Intel®Atom™ x7000RE ® processors family (HDMI+LVDS) 제품확인 WEBS-89I1 Embedded Rugged Fan-less System with Intel Celeron® J6412 SoC, 2x PoE LAN and 16x DI + 16x DO support 제품확인 PJAI-1100F-OX8G Fanless Compact System with NVIDIA® Jetson Orin™ NX SOM for Edge AI Applications -152x112x90 mm 제품확인 DEV2725 Fanless Compact System with NVIDIA® Jetson AGX Orin™ SOM for Edge AI Applications -180 x 60 x 135 mm 제품확인 WSC-C350 3.5” SMARC 2.1 Compliance Carrier with multiple displays and two 2.5GB Ethernet ports 제품확인 LYNX-8110 Compact, fan-less embedded system powered by the Intel Atom Processors x7000RE Series - 120 x 120 x 54 mm 제품확인 PJAI-1100-ON8G Fanless Compact System with NVIDIA® Jetson Orin Nano™ SOM for Edge AI Applications -152x109x63 mm 제품확인 WSC-M510 SMARC® Module with MediaTek Genio 510 Application processor 제품확인 LYNX-812E X7213RE/X7433RE, 32GB LPDDR5, 256GB eMMC, 2.5GbE x2, USB-C, COM x2, -40~70°C, AI-ready, IP30. -120x 74x 120mm 제품확인 Nano-6065 Intel® Core™ Processor N-series/Intel® Processor N-Series/Intel Atom® x7000RE Series Processors based NANO-ITX Board with Triple Display, 2.5GbE LAN, USB 3.2 Gen2, M.2, SATA III 제품확인 Load more 1 2 3 4 5 1 ... 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 ... 29